Vacuum Assisted Reflow 在線式真空回流爐

Heller Industries has developed a vacuum module that inserts directly in its reflow oven line to meet rising demand of high volume, void free, automated inline soldering. This vacuum assisted reflow has been shown to reduce the voids in a solder joint by 99% and allows thermal profiles to be directly ported from non-vacuum reflow applications to

achieve low COO and high UPH.

Features 主要特點

Heller在線式真空回流爐可實現真空焊接的自動化規模量產，降低生產成本；

內置式真空模組，分五段精準抽取真空，實現無空洞焊接 (Void < 1％)；

可直接移植普通回流爐的溫度曲線，曲線方便可調。

• Applies multi-zones to suit various thermal profile requirements

 多溫區設計，更多溫控點，滿足不同溫度曲線要求

• Able to achieve < 1% total void area spec

 有效消除空洞，總空洞麵積可控製在1%以下

• Provides optimized cycle (average 30~60s) to achieve high UPH

 高效生產能力，平均生產節拍在30~60秒

• Utilizes advanced pumping package for fast pump down time

 高效無油真空泵機組，可實現最短降壓時間

• Adopts high efficient flux collection system to eliminate flux condensation

 高效助焊劑回收係統，預防助焊劑殘留